当今各种集成电路微电子器件(CPU,Flash、Memory、controller、Power等),都由大量的各种晶体管与电容、电阻、电感原件构成。随着集成电路器件的搞成集成、高速发展趋势,致使集成电路器件(die及die的半成品、Chip)在生产制造(wafer Fab,封装,测试)与使用(SMT为主)阶段对于受到静电的作用影响越发敏感。其 ...
半导体前端制造wafer fab中必须要做静电防护的一个重要光刻工具-photomask(reticles),否则静电导致的photomask的CD(Critical Dimension,)不良(对65nm制程技术及以下有位敏感)必然会导致半导体器件的光刻良率损失甚至于全部报废。 转载自微信公众号“ESDiS Release”。原文链接: https://mp.weixin.qq.com/s?__ ...
刷新认知:静电领域的主要术语名词,同文转载自微信公众号“ESDiS Release”。 You may need to renew your industrial understandings about the relations and differences between the technical glossaries of electrostatics, electrostatic charge and ESD. Definitions Review Electrostatics:Electrost ...
Electrostatic induced production yields loss and electrical reliability degradations mostly by ESD still continue. Besides the technological barriers of some equipment and processes, the mistakes failed to ineffectively manage electrostatics become more significantly. The opposite ioni ...
关注当前电子制造阶段中ESD所造成的生产良率损失与品质投诉问题解决。 此案例信息:Qorvo北京
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